Recently, Infineon Technologies AG announced its third-generation ultra-low-cost (ULC) mobile phone chip at its headquarters in Neubiberg, Munich, Germany. The X-GOLDTM110 is the world's most integrated, cost-effective, single-chip solution for GSM/GPRS ultra-low-cost handsets. The X-GOLDTM110 has set a new benchmark for the mobile phone industry by reducing the system cost (material cost) of handset manufacturers by 20% compared to existing solutions on the market today.
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Weng Kuan Tan, Global President of Infineon Wireless Communications, said: "We are proud of the successful launch of the third-generation ULC solution. We are seeing an increasing demand for ultra-low cost and entry-level mobile phones. Low-cost solutions are the most important criteria for meeting the needs of most low-income people, so our solutions are well suited to meet the needs of network operators and handset manufacturers entering emerging markets. With this solution, we help These regions have realized low-cost mobile communication services, enabling people here to share the fruits of their national economic development."
The X-GOLD110 is the heart of the Infineon mobile phone platform XMMTM1100, which delivers outstanding performance on a compact 4-layer board. This new platform supports color display, MP3 playback, FM radio, USB charging, and will support dual SIM and camera functions in the future.
Because the platform incorporates multiple technologies and its near-plug-and-play features, the XMM1100 can reduce the handset manufacturer's development cycle from more than a year to 3-4 months. In addition, by reducing the number of peripheral devices from 200 to 50, the XMM1100 can effectively shorten the production and processing time of each mobile phone.
Infineon plans to offer X-GOLD110 samples and XMM1100 reference development boards to customers in the second quarter of 2009, and will begin mass production in the second half of this year.
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