According to the latest report from market regulator Gartner, global semiconductor capital expenditures will grow by 11.9% to reach 62.8 billion U.S. dollars in 2011, but by 2012, capital expenditures will decline slightly by 2.6%, mainly due to semiconductor inventory corrections. There is an oversupply in the foundry industry. In addition, there will be excess supply of memory in the second half of 2013.
The 2013 excess fear of memory Gartner pointed out that the sources of expenditure growth in 2011 were mainly the active spending of foundry, IDM (Integrated Device Manufacturer) upgrading to advanced manufacturing process, and large memory manufacturers actively investing in the second pattern. Technology, global semiconductor capital expenditure this year is expected to reach 62.8 billion US dollars (1.81 trillion TWD), an annual growth of 11.9%.
In the front-end fab equipment, Intel, foundry, and NAND Flash (planted Flash) plant spending will drive the demand for advanced equipment, and immersion lithography, etching is related to some secondary patterns and key advanced logic processing. The deposition sector will benefit from this, and in 2011, the global fab equipment revenue is expected to increase by 11.7%.
Capital expenditures recovered in 2013 However, analysts also warned against market conditions that the upcoming semiconductor inventory revisions and oversupply in the foundry industry will lead to a slight decline of 2.6% in semiconductor capital expenditures in 2012, and it is expected to grow in 2013. 8.9%.
As the world’s leading fabs continue to expand their production capacity, the market for semiconductor equipment is not declining, especially in the advanced 20- and 30-nm generation devices. Among them, Intel, Samsung, and TSMC (2330) are actively expanding their advanced manufacturing processes. Capacity.
As the fab expands its production capacity by 12 tons, many research institutes have announced that there will be overcapacity in the future. In addition to Gartner, another market adjustment agency, IC Insight, also predicts that if wafers are manufactured in 2012, The expansion of production capacity of the plant continues unabated, and oversupply will occur at the end of 2012.
The 2013 excess fear of memory Gartner pointed out that the sources of expenditure growth in 2011 were mainly the active spending of foundry, IDM (Integrated Device Manufacturer) upgrading to advanced manufacturing process, and large memory manufacturers actively investing in the second pattern. Technology, global semiconductor capital expenditure this year is expected to reach 62.8 billion US dollars (1.81 trillion TWD), an annual growth of 11.9%.
In the front-end fab equipment, Intel, foundry, and NAND Flash (planted Flash) plant spending will drive the demand for advanced equipment, and immersion lithography, etching is related to some secondary patterns and key advanced logic processing. The deposition sector will benefit from this, and in 2011, the global fab equipment revenue is expected to increase by 11.7%.
Capital expenditures recovered in 2013 However, analysts also warned against market conditions that the upcoming semiconductor inventory revisions and oversupply in the foundry industry will lead to a slight decline of 2.6% in semiconductor capital expenditures in 2012, and it is expected to grow in 2013. 8.9%.
As the world’s leading fabs continue to expand their production capacity, the market for semiconductor equipment is not declining, especially in the advanced 20- and 30-nm generation devices. Among them, Intel, Samsung, and TSMC (2330) are actively expanding their advanced manufacturing processes. Capacity.
As the fab expands its production capacity by 12 tons, many research institutes have announced that there will be overcapacity in the future. In addition to Gartner, another market adjustment agency, IC Insight, also predicts that if wafers are manufactured in 2012, The expansion of production capacity of the plant continues unabated, and oversupply will occur at the end of 2012.
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