As the driving force for the development of LED industry technology, Haitz's law has been continuously confirmed. The law shows that LED prices will become 1/10 of the original 10 years, and performance will increase by 20 times. The development of LEDs also validates the law, and even the rate of price/performance improvement exceeds the prediction of the law. In 2013, LED lighting has become a new engine for the development of the LED industry and will exceed the backlight market. In order to shake up the huge lighting market, LED lighting products will bloom in the homes of ordinary people. All major LED companies will try their best to promote the rapid development of the LED industry with technology as the core.
As the core of LED lighting products, LED light sources have made great progress in these years. However, the development of LED light sources is related to the packaging materials. These auxiliary materials include LED brackets, solid crystal glues, phosphors and powders. Each innovation of the packaged materials will lead to a revolution in the field of LED light sources. With the development of the industry, the photoelectric conversion efficiency of LED products has surpassed most of the traditional lighting sources. The attention of LED practitioners has gradually shifted from lm/W to lm/$, and the price-performance ratio has become the core competitiveness of LED.
The surface mount (SMD) package form is favored by the market. This series of products is widely supported by customers due to its small size, suitable for mass production, cost-effective, and compatible with mature surface mount technology (SMT). Products in the form of SMD packages are constantly evolving with advances in stent materials. The input power and luminous intensity of a single packaged device are constantly increasing, and the heat resistance of materials is becoming higher and higher. As the market demands for the lm/$ indicator become higher and higher, the direction of increasing lm/$ falls on the chip's high current density drive, which is used in small packaged devices to reduce the material cost of a single package. In this large background, the early PA6T, PA9T and PCT bracket plastic materials can not meet the high quality requirements of LED, so EMC (Epoxy Molding Compound) packaging materials are in the LED application history stage.
EMC Chinese name is epoxy molding compound, also known as epoxy molding compound, and is one of the main raw materials in IC (Integrated Circuit) packaging manufacturing. With the development of IC packaging technology, EMC has also developed rapidly as a major electronic packaging material. With its high reliability, low cost, simple production process and suitable for large-scale production, EMC occupies more than 97% of the entire microelectronic packaging materials market. Now, EMC is expanding its reach into various packaging fields such as semiconductor devices, integrated circuits, consumer electronics, automotive, military, and aerospace. EMC offers an excellent solution for LED packaging applications due to its excellent heat resistance and suitable for large-scale modern production.
EMC is a highly integrated frame form using Molding equipment in modified Epoxy materials and etching technology. Etching copper substrates allows Epoxy to have a larger contact area with copper substrate holders, and is comparable to thermoplastics such as PPA. The strong adhesion makes EMC products unique in terms of moisture resistance and red ink penetration. The package is derived from the IC package but is different from the IC package. Due to changes in materials and structures, EMC products have high heat resistance, UV resistance, high integration, high current consumption, and small size. In particular, the significant improvement in anti-UV performance has led to a significant expansion of EMC product applications, which can cope with the harsh environment of outdoor lighting and automotive lighting, and will have a favorable impact on mature high-end ceramic packaging products.
The packaging in the IC field does not consider the light, and the mechanical protection and airtightness are the targets. Therefore, the black EMC plastic is mainly used. However, the EMC used in the LED packaging field must consider the high light extraction efficiency, and the EMC must have a small light absorption and a high reflectance. White plastic. As a new plastic material, its research and development is difficult. As a result, the EMC material is only in Hitachi and a few internationally strong material manufacturers. The above companies hold EMC materials and packaging patents, and the latter are stuck in patent barriers. In the short term, there is no breakthrough in technology and market, so EMC materials are sold at a higher price.
According to market feedback information, the price of Hitachi EMC materials that have been mass-produced is about 8~9 times that of PA9T TA112 plastic, and the EMC bracket adopts etching process. The cost is 3~5 times of the stamping process, so the EMC bracket is generally high in unit price. The finished package is also higher than the traditional stents using PPA and PCT plastics. However, EMC's lower Epoxy expansion coefficient makes overcurrent use possible. The EMC 3014 has passed the 150mA reliability test, and the power is driven to 0.5W; the EMC 3030 package driver is from 350mA to 600mA, and the power ranges from 1W to 2W, and the reliability is tested in the enterprise. Although the unit price is higher, it drives to higher power, so EMC products can easily obtain higher lm/$ values.
As a packaging practitioner, Jingke Electronics has always been committed to the development of EMC products by keeping up with cutting-edge packaging materials and advanced packaging processes. Drawing on the mature series of ceramic products - easy series process, the EMC 3014, EMC 2835 and EMC 3030 mass production work has been successfully completed, and mass supply has been realized. Among them, EMC 3020 and EMC3535 are in the state of development.
EMC has attracted much attention for its high heat resistance. In pursuit of high cost performance, it has become a consensus in the LED industry for overcurrent use. However, the use of overcurrent is also a risk and opportunity. The biggest risk is the heat treatment. At present, the general EMC packaging process in the industry is: using medium-sized, vertical-structured, low-power chips, low-thermal-conducting insulating adhesives as chip bonding adhesives, and then welding wires, powders, and cuttings to achieve finished products. At present, there are three types of LED chip adhesives: transparent insulating glue, white glue and silver glue. The thermal conductivity of the three types are 0.2W/(mK), 0.6~0.9 W/(mK) and 25~30 W/(mK respectively. Although silver paste is superior in heat conductivity, it absorbs light seriously, and the luminous flux of the packaged product is low. The low thermal conductive transparent insulating rubber is considered as the optimal solution. Although the insulating rubber is made of silica gel, when the EMC product is driven by over current (especially more than 1W), the temperature of the solid crystal layer usually exceeds the Tg temperature of the insulating rubber. The long-term use of the insulating layer will cause yellowing and blackening. quality problem.
Jingke Electronics is not only a packaging company, but also an LED chip company. The company's flip chip technology is well-known in the industry. Based on the flip-chip process of ceramic products - Yi Xing has been in the LED street lights and indoor lighting shine; easy flash as a flash has emerged in the well-known domestic smart phones. Nowadays, Jingke Electronics has made further progress and continuously innovated in technology, and developed EMC series products with independent core technology and differentiated competition. This series of products is based on the latest DA chip technology of Jingke Electronics. It is reasonably routed on the EMC bracket copper substrate, and the interconnection between the LED chip and the EMC bracket is realized through the eutectic process. This series of EMC 3030 products is a cutting-edge, conceptual product. It is currently in the research and development and experimental stage. The chip is connected to the copper substrate of the bracket through the conductive metal. The thermal conductivity of the bonding layer of the chip is more than 100 times that of the transparent insulating layer, completely eliminating the use of super current. The distress of poor heat dissipation.
Based on the advanced chip and packaging technology of Jinke Electronics, EMC 3030 can easily realize 2W driving power, good product reliability, and bracket matching with higher heat-resistant reflective materials such as SMC (Silicon Molding Compound), which can achieve 2~3W ultra-high power use. .
As the core of LED lighting products, LED light sources have made great progress in these years. However, the development of LED light sources is related to the packaging materials. These auxiliary materials include LED brackets, solid crystal glues, phosphors and powders. Each innovation of the packaged materials will lead to a revolution in the field of LED light sources. With the development of the industry, the photoelectric conversion efficiency of LED products has surpassed most of the traditional lighting sources. The attention of LED practitioners has gradually shifted from lm/W to lm/$, and the price-performance ratio has become the core competitiveness of LED.
The surface mount (SMD) package form is favored by the market. This series of products is widely supported by customers due to its small size, suitable for mass production, cost-effective, and compatible with mature surface mount technology (SMT). Products in the form of SMD packages are constantly evolving with advances in stent materials. The input power and luminous intensity of a single packaged device are constantly increasing, and the heat resistance of materials is becoming higher and higher. As the market demands for the lm/$ indicator become higher and higher, the direction of increasing lm/$ falls on the chip's high current density drive, which is used in small packaged devices to reduce the material cost of a single package. In this large background, the early PA6T, PA9T and PCT bracket plastic materials can not meet the high quality requirements of LED, so EMC (Epoxy Molding Compound) packaging materials are in the LED application history stage.
EMC Chinese name is epoxy molding compound, also known as epoxy molding compound, and is one of the main raw materials in IC (Integrated Circuit) packaging manufacturing. With the development of IC packaging technology, EMC has also developed rapidly as a major electronic packaging material. With its high reliability, low cost, simple production process and suitable for large-scale production, EMC occupies more than 97% of the entire microelectronic packaging materials market. Now, EMC is expanding its reach into various packaging fields such as semiconductor devices, integrated circuits, consumer electronics, automotive, military, and aerospace. EMC offers an excellent solution for LED packaging applications due to its excellent heat resistance and suitable for large-scale modern production.
EMC is a highly integrated frame form using Molding equipment in modified Epoxy materials and etching technology. Etching copper substrates allows Epoxy to have a larger contact area with copper substrate holders, and is comparable to thermoplastics such as PPA. The strong adhesion makes EMC products unique in terms of moisture resistance and red ink penetration. The package is derived from the IC package but is different from the IC package. Due to changes in materials and structures, EMC products have high heat resistance, UV resistance, high integration, high current consumption, and small size. In particular, the significant improvement in anti-UV performance has led to a significant expansion of EMC product applications, which can cope with the harsh environment of outdoor lighting and automotive lighting, and will have a favorable impact on mature high-end ceramic packaging products.
The packaging in the IC field does not consider the light, and the mechanical protection and airtightness are the targets. Therefore, the black EMC plastic is mainly used. However, the EMC used in the LED packaging field must consider the high light extraction efficiency, and the EMC must have a small light absorption and a high reflectance. White plastic. As a new plastic material, its research and development is difficult. As a result, the EMC material is only in Hitachi and a few internationally strong material manufacturers. The above companies hold EMC materials and packaging patents, and the latter are stuck in patent barriers. In the short term, there is no breakthrough in technology and market, so EMC materials are sold at a higher price.
According to market feedback information, the price of Hitachi EMC materials that have been mass-produced is about 8~9 times that of PA9T TA112 plastic, and the EMC bracket adopts etching process. The cost is 3~5 times of the stamping process, so the EMC bracket is generally high in unit price. The finished package is also higher than the traditional stents using PPA and PCT plastics. However, EMC's lower Epoxy expansion coefficient makes overcurrent use possible. The EMC 3014 has passed the 150mA reliability test, and the power is driven to 0.5W; the EMC 3030 package driver is from 350mA to 600mA, and the power ranges from 1W to 2W, and the reliability is tested in the enterprise. Although the unit price is higher, it drives to higher power, so EMC products can easily obtain higher lm/$ values.
As a packaging practitioner, Jingke Electronics has always been committed to the development of EMC products by keeping up with cutting-edge packaging materials and advanced packaging processes. Drawing on the mature series of ceramic products - easy series process, the EMC 3014, EMC 2835 and EMC 3030 mass production work has been successfully completed, and mass supply has been realized. Among them, EMC 3020 and EMC3535 are in the state of development.
APT EMC 3014 
APT EMC 3030 
APT EMC 2835
EMC has attracted much attention for its high heat resistance. In pursuit of high cost performance, it has become a consensus in the LED industry for overcurrent use. However, the use of overcurrent is also a risk and opportunity. The biggest risk is the heat treatment. At present, the general EMC packaging process in the industry is: using medium-sized, vertical-structured, low-power chips, low-thermal-conducting insulating adhesives as chip bonding adhesives, and then welding wires, powders, and cuttings to achieve finished products. At present, there are three types of LED chip adhesives: transparent insulating glue, white glue and silver glue. The thermal conductivity of the three types are 0.2W/(mK), 0.6~0.9 W/(mK) and 25~30 W/(mK respectively. Although silver paste is superior in heat conductivity, it absorbs light seriously, and the luminous flux of the packaged product is low. The low thermal conductive transparent insulating rubber is considered as the optimal solution. Although the insulating rubber is made of silica gel, when the EMC product is driven by over current (especially more than 1W), the temperature of the solid crystal layer usually exceeds the Tg temperature of the insulating rubber. The long-term use of the insulating layer will cause yellowing and blackening. quality problem.
Jingke Electronics is not only a packaging company, but also an LED chip company. The company's flip chip technology is well-known in the industry. Based on the flip-chip process of ceramic products - Yi Xing has been in the LED street lights and indoor lighting shine; easy flash as a flash has emerged in the well-known domestic smart phones. Nowadays, Jingke Electronics has made further progress and continuously innovated in technology, and developed EMC series products with independent core technology and differentiated competition. This series of products is based on the latest DA chip technology of Jingke Electronics. It is reasonably routed on the EMC bracket copper substrate, and the interconnection between the LED chip and the EMC bracket is realized through the eutectic process. This series of EMC 3030 products is a cutting-edge, conceptual product. It is currently in the research and development and experimental stage. The chip is connected to the copper substrate of the bracket through the conductive metal. The thermal conductivity of the bonding layer of the chip is more than 100 times that of the transparent insulating layer, completely eliminating the use of super current. The distress of poor heat dissipation.
APT based on DA chip structure EMC 3030
Based on the advanced chip and packaging technology of Jinke Electronics, EMC 3030 can easily realize 2W driving power, good product reliability, and bracket matching with higher heat-resistant reflective materials such as SMC (Silicon Molding Compound), which can achieve 2~3W ultra-high power use. .
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