September 26 news, according to the latest rumors, Motorola's upcoming Nexus 6 may be equipped with a larger size display, and the display resolution will reach 2560x1440 pixels.
According to reports on the 9to5Google website, they learned that the next-generation Nexus may be named Nexus X. The product will be equipped with a 5.92-inch display, and the overall size may be larger. The display is said to have a resolution of 2560x1440 pixels and a pixel density of 498 ppi.
The current Nexus 5 is equipped with a 4.95-inch full HD display with a resolution of 1920x1080 pixels. The Nexus 6 will not only have a larger display than the previous generation, but will also be similar in design to the second-generation Moto X, with minor changes to improve ease of use. It is said that the Nexus 6's microphone, headphone jack, and SIM card slot are all in the same position as the Moto X. At least the proportion is the same, because the Moto X's size is relatively small. Like the Moto X, the Nexus 6 will also use an aluminum housing.
The Nexus 6 product code is Shamu, which will carry a Snapdragon 805 processor, 3GB of RAM, and 32GB of memory. It is also equipped with a 13 million-pixel rear camera and supports 4K Ultra HD video. The front camera is 2 million pixels, which is the same as the Moto X configuration.
Of course, this information is still only rumored. 9to5Google also admitted that the device mentioned here is just a tablet phone to be released by Motorola. Whether or not it is the latest product of the Nexus series, it is said that it will be released in November this year.
SMA means surface mount assembly. It is a new generation of electronic assembly technology, which compresses traditional electronic components into a device with a volume of only a few tenths.
Surface mounting is not a new concept, it is derived from earlier processes, such as flat mounting and mixed mounting.
For the assembly of electronic circuits, a point-to-point wiring method was initially adopted, and there was no substrate at all. The packaging of the first semiconductor device uses radial pins, which are inserted into the through holes of the monolithic circuit boards that have been used for the packaging of resistors and capacitors. Active components have been widely used in the past ten years.
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