Printed electronic technology has entered the process of commercialization

Printed electronic technology S has entered the commercialization process. The reporter of this magazine is still the core area of ​​the electronics industry in Silicon Valley. You will be in touch with the latest information related to electronic information technology.

The author visited the US Printed Electronics, which was held in Sanose, Guagu, USA on December 3-4. This exhibition includes all applications, technologies, materials and investment opportunities related to printed electronics. More than 50 exhibitors from the United States, Europe, Japan and other countries participated.

After several years of development, printed electronic technology has stepped out of the ivory tower of scientific research and started commercial use. The commercialization of this technology will likely bring a revolution in the field of electronic manufacturing, and it will create a new industrial ecology. "Printed electronics" refers to circuits made with conductive polymers and nano-metal ink using various printing technologies. This type of printable electronics can be used for mass production of products that cannot be produced using CMOS, such as RFID tags, rollable displays or smart packaging, solar cells, etc.

Low-cost, high-speed printing technology will change the entire electronics industry and develop new electronic products. This technology can be used to generate electronic circuits and electronic devices. The emergence of inkjet printers and semiconductor inks will be able to free the electronics manufacturing industry from the exponential increase in costs, reduce costs to an appropriate level, and greatly increase the economic viability of personalized manufacturing. At the same time, the low cost of production and materials is expected to bring a new generation of electronic products. From the RFID identification marks of disposable promotional materials to the posters of the entire wall, it is possible to use implantable photoelectric units or sensors.

So far, 3M, DuPont and DOW have carried out a lot of research work in this field, making great progress in printable electronic technology from the field of materials.

It is worth mentioning that there was an exhibitor called NanoMas Technology Co., Ltd., a company formed by mainland Chinese aesthetics. The company's products are low-cost, highly conductive metal nanoparticle materials (less than 10 nanometers), which makes its NonoSilver conductive inks have good performance at low processing temperatures (less than 150 degrees Celsius), which is the ideal temperature for printing electronic devices on plastic or paper. The founders of the company are two mainland scholars who have obtained a Ph.D. in the United States, Dr. Yang Zhihao and Dr. Xu Zhiyong, and have multiple patents in the field of new materials. The company has just received venture capital investment from BASF, a leading German chemical company, and can still obtain investment during the current economic downturn, indicating that NanoMas Technology Co., Ltd. has a very promising technology market prospect.

The emphasis on the mobile phone business has continued the research and development of printed electronics in Motorola's period, which has become the theme of its continuous attention. The technology may be used to print circuits to help mobile phones achieve ultra-thin form factors, and can be used for applications such as tracking and smart point-of-sale packaging. In addition, the US National Bureau of Standards (NISB) once had a project called "Printedorganic ASICs: a revolutionary technology" (Printedorganic ASICs: adisruptivetechnology), whose purpose is to develop organic materials and processing technologies to achieve ASICs and displays Low-cost production of large-area electronic products.

According to survey data, printed electronics technology and industry involve organic, inorganic, or synthetic materials that can be printed to form circuits or electronic devices. They can generate transistor circuits, displays, sensors, optoelectronics, batteries, lighting devices, conductors, and semiconductors.

In about 20 years, a huge market of more than 300 billion US dollars will be formed, resulting in huge business, because this technology will provide many benefits that are different from those provided by the existing electronics industry, such as low cost, excellent performance in some cases, Durable and flexible, ultra-thin, environmentally friendly and fault-tolerant. More importantly, China has fallen behind in the development of the semiconductor industry. Although the country has given a lot of support in recent years, it is difficult for China to occupy a dominant position in the huge semiconductor industry. The printed electronics industry is still in its infancy. Europe precedes the United States, and Japan and South Korea in Asia are also starting. Taiwan, led by the Industrial Research Institute, has also begun to invest in keeping up. China should also start to strive for a certain position in this new industry. 53

Blind And Buried Hole PCB

HDI is the English abbreviation for High Density Interconnector. High-density interconnect (HDI) manufacturing is one of the fastest growing areas in the printed circuit board industry. From the first 32-bit computer from HP in 1985 to the large client server with 36 sequential multi-layer printed boards and stacked micro-vias, HDI/mini via technology is undoubtedly the future PCB architecture. Smaller ASICs and FPGAs with smaller device spacing, I/O pins, and embedded passives have shorter rise times and higher frequencies, all of which require smaller PCB feature sizes, which drives Strong demand for HDI/mini vias.
HDI process
First-order process: 1+N+1
Second-order process: 2+N+2
Third-order process: 3+N+3
Fourth-order process: 4+N+4

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