The final polycondensation reactor is immersed in hot TEG (below boiling point) to control a small amount of evaporation to the vacuum system. After condensation, part of the aldehyde is released from the liquid seal tank. The condensed TEG is adjusted by reflux compensation through the liquid level adjustment system. During the hot cleaning, the amount of evaporation is controlled by adjusting the pressure, so that the TEG in the reactor is evaporated to the liquid-sealed tank for circulating cleaning. Nitrogen gas is used to control the evaporation and protect during the cleaning process. After the polymerization reactor is shut down, the final shrinkage kettle is subjected to EG thermal cleaning, and the actual cleaning time is 8h. The purpose of thermal cleaning is to remove the easily cleaned polymer melt remaining in the kettle.
After the EG heat cleaning of the final shrinking kettle is completed, the EG in the evaporator E06 is replaced with a large amount of fresh EG. The purpose of the replacement is to remove the contaminated EG containing alcoholysis products. Clean. The barrel pump and gear pump of the system heating and cleaning add TEG to the storage tank. After the liquid level reaches the set value, it is sent to the final shrinking kettle. The heat medium system of the final shrinking kettle is heated at a rate of 10 ℃ / h, the temperature reaches 260 ～ 265 ℃, and the cleaning temperature has been reached. The on-site inspection system has no leakage, and the cleaning timing is started. As this cleaning uses the automatic compensation of the return flow, the system has no disturbance during the cleaning, and the temperature and pressure are stable. During TEG thermal cleaning, no TEG leakage occurred on site. After the TEG steaming and discharging of the system and the water washing and cleaning of the system are completed, evaporation and barreling are carried out, and the TEG vapor in the large amount of evaporation process plays a good self-cleaning role on the wall of the gas phase part of the reactor. TEG thermal cleaning effect and evaluation. After TEG cleaning, the scale is loose and it is very easy to clean. After the final shrinkage kettle is cleaned, the inner wall and the disc almost see metallic luster. After the E15 and vacuum system cleaning, the inner wall of the equipment is as bright as new.
As the structural support and optical signal transmission pathway and medium, flexible substrates are playing ever-increasingly important roles in advanced optoelectronic display devices. The use of flexible substrates will significantly reduce the weight of flat panel displays and provide the ability to conform, bend or roll a display into any shape. Moreover, it will open up the possibility of fabricating displays by continuous roll processing, thus providing the basis for cost-effective mass production. Flexible substrate mainly used in thermoelectric refrigerator accessories, high-end car seats, car cold cup, car refrigerator, head display, car power, home appliances, medical devices, semiconductor chips, laser projection, optical device packaging in optical fiber communication and other fields.
Currently, there are mainly three types of candidates for flexible substrates: ultrathin glass, metal foil, and plastic (polymer) films. The raw material use for our flexible substrate is PE base double-sided copper clad with 0.3mm thickness. We are equipped with professional metal etching equipment and exposure development equipment. We use fine etching process and manufactures, we can guarantee that our etching flexible substrate can achieve double-sided etching of different graphics, alignment, neatly arranged, and no shedding, no incomplete, no pores, no inclusions and other appearance defects.
Etching Flexible Substrate,Double-Sided Etching,PE Base Double-sided Copper Clad Flexible Substrate
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