[Source: "High-tech LED - Technology and Applications" June issue]
Compared with incandescent lamps, semiconductor lighting can save up to 80% of energy, and save 50% more energy than today's popular energy-saving lamps. The service life of incandescent lamps is only 1000-2000 hours, the service life of good quality energy-saving lamps is about 5,000 hours, and the service life of LED lamps can reach more than 100,000 hours. Compared with traditional lighting, LED lighting has significant advantages such as energy saving, environmental protection and long service life. Therefore, it is a general trend to replace the incandescent lamps and fluorescent lamps used in conventional lighting with semiconductor lamps.
Chip package is an important part of LED luminaires. Only by designing a reasonable structure and good heat dissipation package structure, it is possible to produce good quality LED lamp beads. The substrate material is the most important material basis in the package structure, which is generated by the chip. A large amount of heat conduction to the radiator bridge is the key to determining the temperature of the chip after packaging. The substrate material with high thermal conductivity has low thermal resistance, can quickly transfer the heat generated by the chip to the heat sink, and the junction temperature of the chip is low, and the service life of the lamp is long; on the contrary, the thermal resistance of the substrate material with low thermal conductivity is high, and the chip generates The heat is transferred to the heat sink at a slow rate, the junction temperature of the chip is high, and the life of the lamp is short.
The substrate material required for high-power LED chip integrated package requires temperature stability, and the high thermal conductivity electrical insulation layer separates the heat sink (usually aluminum plate) from the solder chip to achieve thermoelectric separation. the goal of. The aluminum-based ceramic composite board is a LED chip integrated package substrate material with good thermal conductivity and good temperature stability for meeting the high-power LED chip integrated package.
The main integrated package substrate materials used today:
1. Aluminum-based PCB board
The structure of the aluminum-based or copper-based PCB board: an aluminum plate or a copper plate is used as a substrate heat sink, a resin is used as a bonding agent to bond a layer of copper foil to form a package circuit, and a resin as a bonding agent is also used as an electrical insulating layer. The aluminum-based PCB board has a simple manufacturing process and a low cost.
The aluminum-based PCB board uses epoxy resin as the insulating layer. The thermal conductivity of the epoxy resin is low (the highest thermal conductivity of the imported resin is <3), the thermal resistance is large, and multiple high-power chips are integrated and packaged, and the heat is concentrated and the heat generated. Can not be transmitted to the heat sink heat sink in time, the junction temperature of the chip will rise rapidly, the chip luminous efficiency is greatly reduced, and the resin is not suitable for long-term operation at > 100 ° C high temperature, easy aging, reduced adhesion, and reduced insulation.
2. Ceramic substrate
Ceramic is a non-metallic material with high temperature resistance (melting point > 2000 ° C) with high insulation, high temperature stability and good thermal conductivity. It is formed by vacuum coating on the surface of ceramic sheet to form a thin layer of copper or silver. Engraving technology to make a variety of complex circuits has been widely used in the field of microelectronics.
The ceramic substrate not only has excellent electrical insulation properties, but also has good thermal conductivity. The thermal expansion coefficient (CTE) of the ceramic substrate is very consistent with the LED chip material, and does not separate due to changes in operating temperature. At present, research and application of high-power LED chip packages are concentrated on ceramic heat-dissipating substrates. Ceramic heat sink substrate is the mainstream substrate for future high power LED integrated package.
For more information, please refer to the June issue of "High-tech LED-Technology and Applications" magazine.
Compared with incandescent lamps, semiconductor lighting can save up to 80% of energy, and save 50% more energy than today's popular energy-saving lamps. The service life of incandescent lamps is only 1000-2000 hours, the service life of good quality energy-saving lamps is about 5,000 hours, and the service life of LED lamps can reach more than 100,000 hours. Compared with traditional lighting, LED lighting has significant advantages such as energy saving, environmental protection and long service life. Therefore, it is a general trend to replace the incandescent lamps and fluorescent lamps used in conventional lighting with semiconductor lamps.
Chip package is an important part of LED luminaires. Only by designing a reasonable structure and good heat dissipation package structure, it is possible to produce good quality LED lamp beads. The substrate material is the most important material basis in the package structure, which is generated by the chip. A large amount of heat conduction to the radiator bridge is the key to determining the temperature of the chip after packaging. The substrate material with high thermal conductivity has low thermal resistance, can quickly transfer the heat generated by the chip to the heat sink, and the junction temperature of the chip is low, and the service life of the lamp is long; on the contrary, the thermal resistance of the substrate material with low thermal conductivity is high, and the chip generates The heat is transferred to the heat sink at a slow rate, the junction temperature of the chip is high, and the life of the lamp is short.
The substrate material required for high-power LED chip integrated package requires temperature stability, and the high thermal conductivity electrical insulation layer separates the heat sink (usually aluminum plate) from the solder chip to achieve thermoelectric separation. the goal of. The aluminum-based ceramic composite board is a LED chip integrated package substrate material with good thermal conductivity and good temperature stability for meeting the high-power LED chip integrated package.
The main integrated package substrate materials used today:
1. Aluminum-based PCB board
The structure of the aluminum-based or copper-based PCB board: an aluminum plate or a copper plate is used as a substrate heat sink, a resin is used as a bonding agent to bond a layer of copper foil to form a package circuit, and a resin as a bonding agent is also used as an electrical insulating layer. The aluminum-based PCB board has a simple manufacturing process and a low cost.
The aluminum-based PCB board uses epoxy resin as the insulating layer. The thermal conductivity of the epoxy resin is low (the highest thermal conductivity of the imported resin is <3), the thermal resistance is large, and multiple high-power chips are integrated and packaged, and the heat is concentrated and the heat generated. Can not be transmitted to the heat sink heat sink in time, the junction temperature of the chip will rise rapidly, the chip luminous efficiency is greatly reduced, and the resin is not suitable for long-term operation at > 100 ° C high temperature, easy aging, reduced adhesion, and reduced insulation.
2. Ceramic substrate
Ceramic is a non-metallic material with high temperature resistance (melting point > 2000 ° C) with high insulation, high temperature stability and good thermal conductivity. It is formed by vacuum coating on the surface of ceramic sheet to form a thin layer of copper or silver. Engraving technology to make a variety of complex circuits has been widely used in the field of microelectronics.
The ceramic substrate not only has excellent electrical insulation properties, but also has good thermal conductivity. The thermal expansion coefficient (CTE) of the ceramic substrate is very consistent with the LED chip material, and does not separate due to changes in operating temperature. At present, research and application of high-power LED chip packages are concentrated on ceramic heat-dissipating substrates. Ceramic heat sink substrate is the mainstream substrate for future high power LED integrated package.
For more information, please refer to the June issue of "High-tech LED-Technology and Applications" magazine.
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