Vapor compression refrigeration system for high power LED cooling

Electro-mechanical engineering is the total electrical energy of thermoelectric conversion: it can be concluded that the system can not only meet the cooling requirements of 400W high-power LEDs, but also can recover nearly 201.2W of electric power to supplement LED power by inputting 85W compressor electric power. The device does have the advantages of high efficiency and energy saving. Technical feasibility analysis For the packaging and application of high-power LEDs, the components of the energy-saving vapor compression refrigeration system must have the characteristics of simple structure, small volume, low noise, high thermoelectric conversion efficiency, etc., which are embodied in: 1) Refrigeration compressor Miniaturization. The micro-triangular rotor compressor can be used. This type of compressor has the advantages of good economical efficiency of the reciprocating compressor, and is free from reciprocating motion, which is advantageous for achieving high speed, and thus has the advantages of small body weight, small vibration and low noise. The heat exchanger is compact. The use of a compact and efficient heat exchanger not only reduces the size and weight of the entire system, but also greatly increases the energy consumption ratio due to the reduced power consumption of the system. Therefore, the evaporator of the refrigeration system can be cooled by using a microchannel evaporator. The board absorbs the heat released by the LED chip. In order to effectively recover the heat released by the condenser, it is necessary to ensure that the condenser has sufficient contact area with the chip type thermoelectric converter, so that the condenser can be a tube-and-tube condenser. 3) Integrated package of LED chip and evaporator.

For high-power LED devices, the total thermal resistance is the sum of the thermal resistance of several heat sinks on the hot path of the PN junction to the external environment, including the internal heat sink thermal resistance of the LED itself, and the internal heat sink between the PCB boards. The thermal resistance of the thermal paste, the thermal resistance of the thermal paste between the PCB and the external heat sink, and the thermal resistance of the external heat sink. Each heat sink in the heat transfer circuit can cause some obstacles to heat transfer. Reducing the amount of internal heat sink, using the thin film process to make the necessary interface electrode heat sink and insulation layer directly on the metal heat sink can greatly reduce the total thermal resistance. This technology is likely to become the mainstream of high-power LED thermal packaging in the future. Therefore, for a high-power LED cooling vapor compression refrigeration system, reducing the thermal resistance between the LED and the evaporator is crucial for improving the heat exchange efficiency of the entire system.

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