According to Taiwan’s “Economic Daily†report, there is news from the market that the 28nm newest product of TSMC's GPU major customer, AMD, will be transferred to its own GLOBALFOUNDRIES company’s OEM. GLOBALFOUNDRIES has successively received advanced process orders from AMD, Qualcomm and STMicroelectronics, which were formerly important customers of TSMC and challenged TSMC's leading position in the advanced process OEM market. Both sides' competition is becoming increasingly intense.
Global graphics chip duo AMD and NVIDIA are not only TSMC’s most important customers in the PC chip field, but also the main force contributing to TSMC’s advanced process revenue. Half of the revenue of TSMC's 40nm process comes from the contributions of AMD and NVIDIA.
According to IC Insights statistics, TSMC finally won 52% of the global wafer foundry market share last year. AMD's transfer order may cause the market share of TSMC to fall below 50%. At the same time, advanced manufacturing process is the main force contributing to TSMC's revenue. If the high-end process city's market share is lost, it means that revenue may decrease.
GLOBALFOUNDRIES, a joint venture between Abu Dhabi Investment Corporation (ATIC) and AMD in the United Arab Emirates, followed a merger with Singapore Chartered Semiconductor last year and targeted TSMC. The company not only called for 30% of the global wafer foundry market within two years, but also increased its capital expenditure from US$2.5 billion to US$2.7 billion to US$2.8 billion, becoming the world’s fifth-largest semiconductor plant for capital expenditure. TSMC only acquired 40nm orders for AMD's next-generation Funsion processor from GLOBALFOUNDRIES. AMD recently announced the latest 28nm GPU products, which will be transferred to GLOBALFOUNDRIES production early next year. The competition between the two parties is very intense. Analysts said that TSMC's advanced manufacturing process can lead significantly, in addition to strong research and development capabilities, is relying on the help of NVIDIA and AMD's huge capacity. The industry believes that if AMD disperses 28nm GPUs into GLOBALFOUNDRIES foundry, it will pose a threat to TSMC's advanced process market share.
The industry representatives of the wafer industry pointed out that when Abu Dhabi’s investment decision reached GLOBALFOUNDRIES last year, it spoke with AMD about the incidental conditions. The two sides signed a memorandum of cooperation on contract manufacturing. As long as the GLOBALFOUNDRIES advanced process technology is achieved, the AMD GPU will go to GLOBALFOUNDRIES. OEM.
In August last year, GLOBALFOUNDRIES also won orders for subordinate 45nm foundry chips from integrated chip maker STMicroelectronics. At the beginning of this year, it signed a contract with Qualcomm, the three largest customers of TSMC, to obtain orders for Qualcomm's 45nm and 28nm products. However, GLOBALFOUNDRIES does not currently have formal 40nm services. Only 45nm, the industry's 28nm mass production capacity of GLOBALFOUNDRIES remains to be observed.
According to TSMC's plans, 28nm low-power process has been trial production in January, and high-speed process will be launched in September. Full line services will be available in the first half of next year. GLOBALFOUNDRIES 28nm is expected to test production early next year and provide production services in the second half of next year as soon as possible. The gap with TSMC is within one quarter.
1.ANTENK Wire to Board connectors are avialable in different terminations and sizes intended for use on a variety of applications. These connectors provide power and signal with different body styles, termination options, and centerlines. To find the wire to board set required, click on the appropriate sub section below.
2.Our products are widely used in electronic equipments,such as monitors ,electronic instruments,computer motherboards,program-controlled switchboards,LED,digital cameras,MP4 players,a variety of removable storage disks,cordless telephones,walkie-talkies,mobile phones,digital home appliances and electronic toys,high-speed train,aviation,communication station,Military and so on
Antenk Wire To Board Connectors Ranges:
Power Wire to Board
IDC Wire to Board
Locking Wire to Board
Latching Wire to Board
Fine Pitch Wire to Board
Wire to Board Connectors Information
Description
Wire-to-board connectors are used to interconnect printed circuit boards (PCBs) by using connectors attached to wires.
Specifications
Specifications for a wire to board connector include the following.
Wire-entry angle - There are three wire-entry angle styles: vertical, right-angle, and bottom-entry.
Wire size - Wire size is usually measured in American wire gauge (AWG), a standard for non-ferrous wire conductor sizes. The term "gauge" refers to the wire`s diameter. The higher the gauge number, the smaller the diameter and the thinner the wire.
Circuits or positions - With wire to board connectors, the number of circuits or positions may range from 1 to 120.
Pitch or center spacing - Pitch or center spacing is measured in millimeters (mm) or inches.
Lock to mating style - There are three basic lock-to-mating styles: positive, friction, and friction ramp.
Maximum current - The maximum current or current-carrying capacity is measured in amperes (A) and ranges from 1.0 A to 50. A.
Termination Methods
Crimp is the physical compression of a contact wire around a conductor to make an electrical and mechanical connection. Insulation displacement connectors (IDC) slice through the cable insulation to make a connection. Choices for termination method also include cage clamp, screw, tabs, and solder cups.
PCB Mounting Styles
With wire to board connectors, there are four choices for PCB mounting.
Through-hole technology (THT) mounts components on a PCB by inserting component leads through holes in the board and then soldering the leads in place on the opposite side of the board.
Surface mount technology (SMT) adds components to a PCB by soldering component leads or terminals to the top surface of the board. SMT components have a flat surface that is soldered to a flat pad on the face of the PCB. Typically, the PCB pad is coated with a paste-like formulation of solder and flux.
Press-fit and compression-style Board To Board Connectors are also commonly available.Wire to Board Connectors Information
Standards
Wire-to-board connectors carry approvals from various national and international organizations. In North America, they often bear marks from Underwriters Laboratories (UL) and/or the Canadian Standards Association (CSA).
A wire to board connector for the European marketplace should comply with the Restriction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) directives from the European Union (EU). Wire-to-board connectors that comply with other requirements are also available.
BS 9526 N0001 - Specification for multi-contact edge socket electrical connectors.
Wire To Board Connectors,Wire Harness,Pcb Wire To Board Connector,Pin Wire To Board Connector,IDC Wire to Board,Locking Wire to Board,Latching Wire to Board,Fine Pitch Wire to Board
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