Eutectic solid crystal equipment and process technology

[Text / "High-tech LED - Technology and Applications" September issue]

Overview


Taiwan Industrial Technology Institute and the LED epitaxial plant, the company, and the high-power solid-crystal equipment factory, Guanghua Technology, to vertically integrate the LED upstream and downstream, and developed the first metal solid crystal mass production machine. On July 11, 2012, the third item of “The Key Tasks” of the “12th Five-Year Special Plan for Semiconductor Lighting Technology Development” announced by the Ministry of Science and Technology, the third item of “Frontier Technology Research”, “Packaging and System” The integration research clearly includes the encapsulation materials such as solid crystal eutectic solder and related process development.

At present, the solid-crystal eutectic solder and eutectic process technology is blank in China, and Taiwan has far surpassed the mainland in the field of “solid-state eutectic solder and eutectic process technology”. After one year of research and development, Shenzhen Invo Technology Co., Ltd. has successfully manufactured a complete set of equipment for realizing eutectic solid crystal with metal solder, and successfully achieved mass production. The mass production capacity is 3K/H, and the yield rate is 99%. In February 2012, the company passed the national invention patent application. The patent name is a LED wafer micro-welding eutectic method, and the patent acceptance number is 201210049839.5.

I. Introduction to eutectic welding

Eutectic welding is also known as low melting point alloy welding. The basic characteristic of a eutectic alloy is that two different metals can form an alloy at a weight ratio well below the respective melting point temperatures. Eutectic bonding refers to the phenomenon of eutectic fusion of eutectic solder at relatively low temperatures. The eutectic alloy changes directly from solid to liquid without passing through the plastic phase, and its melting temperature is called eutectic temperature.

The eutectic soldering method is divided into hard eutectic soldering method and soft eutectic soldering method: eutectic soldering in which the gold content in the solder is 80% is called hard eutectic soldering, also known as gold tin eutectic soldering method; silver tin The eutectic soldering method is also called "soft solder" soldering because its welding mechanical strength is slightly smaller than that of gold tin. Silver-tin eutectic soldering also has the advantages of high mechanical strength, low thermal resistance, good stability and high reliability. The process control of thickness and high temperature resistance of bracket gold plating/silver plating will be greatly reduced; equipment cost is low, finished product The high rate and the product void rate are greatly reduced, which is the best cost-effective eutectic welding method at this stage. The comparison of the two eutectic welding methods is as follows:


Second, analysis of eutectic solid crystal technology

(1) Technical bottleneck in LED development

Usually about 20% of the input power of LED high-power products is converted into light, and about 80% of the remaining energy is directly converted into heat. If it cannot be exported in time, the LED junction temperature will be too high, which will affect the product life cycle, luminous efficiency and stability. In order to facilitate transportation, installation and disassembly, in order to be more beautiful, adapt to various special needs, and to reduce costs, LED display companies have been trying to transform the system architecture to make the cabinet thinner and lighter, and to make the connection method change. Be more flexible.

For a long time, the mainstream driver ICs in the market have been using the traditional SPI mode in the communication mode. The duty cycle of the clock signal is easily deformed, and errors are accumulated, resulting in a failure in communication rate and limited serial length.

Silan Micro fully considered the simplification of the system architecture in the technical innovation of IC design. The module management IC (SC17124) uses the original "clock regeneration" technology, and the output clock of each IC is regenerated. In this way, the offset generated by the clock signal does not accumulate during the cascading process, which greatly improves the stability and transmission distance of the communication, and can be infinitely cascaded in terms of stability. At the same time, the SC17124 also has built-in gamma correction, which reduces the communication data between the controller and the module management IC to 8 bits. The communication speed is no longer a bottleneck, which can make the serial length go further, which is beneficial to simplify the cabinet. structure. The number of communication lines of the SC17124 is also reduced. The Ethernet interface can be used for inter-module connection. Compared with the traditional use of the cable interface, the cabinet structure can be made lighter and thinner.

Unfinished

For more information, please refer to the September issue of "High-tech LED-Technology and Applications"

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