LED is a kind of semiconductor component, and the core is a chip composed of p-type and n-type semiconductor. There is a transition layer between the p-type semiconductor and the n-type semiconductor, called a pn junction. When the number of carriers injected into the pn junction is sufficiently large, the effect of converting electrical energy into light energy can be achieved. General low-power LED products have the advantages of low energy consumption, small size, fast response time, multiple light color output, long product life and no harmful mercury.
Although the light-emitting tube is a cold light source, the light efficiency of the LED is low, and a large amount of electric energy is required to be converted into light energy in a high luminous efficiency/luminous efficiency (per watt lumen or lm/W) LED lamp application. A large current generates conductive resistance heat on a semiconductor material, and an LED made of a semiconductor material is not resistant to high temperatures, causing overheating to greatly reduce the light output rate and lifetime of the LED lamp.
Proper thermal management and design can control the operating temperature of high-performance LED lamps within an acceptable range to ensure the reliability, longevity and optimal light output of the lamps. 2 is a schematic structural view of a conventional LED lamp, and a black arrow indicates a heat conduction path from the LED module to the heat sink.
If the contact area between the base material and the heat sink is enlarged, it can be seen that the contact surface is composed of fine and irregular concave and convex portions. These embossed portions create a large number of air holes, resulting in poor heat conduction; therefore, the use of a suitable thermal interface filler material (TIM) to fill the air holes in the heat conduction path is an extremely important part of the thermal management and design of high efficiency LED lamps.
Figure 2: Contact area between the base material and the heat sink.
In order to meet the actual LED application and design requirements, Dongguan Yimei Electronic Products Co., Ltd. provides a variety of interface filling materials with different thermal and physical properties. In addition to the traditional thermal paste and phase change material (PCM), Yimei's self-adhesive self-adhesive thermal interface pad is more suitable for galvanically isolated LED applications; plus years of product design and size cutting experience, can be used for users Provides thermally stable products that are dimensionally stable, cost effective, and easy to handle and assemble.
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