TE Connectivity ( TE ), a global leader in connectivity and sensors, today announced the availability of the LGA 3647 socket for the new processor specific to Intel's latest server platform. The new LGA 3647 socket offers higher performance and better system scalability to meet the next-generation design requirements of the latest CPUs. As one of the few providers of this technology, TE will provide key technology support for this new socket for data center and high performance computing (HPC) new platforms.
TE's LGA sockets allow the processor and printed circuit board (PCB) to be connected to the PCB by applying pressure. As computing power increases, so does the number of pins on the processor chip. The LGA 3647 is the first LGA socket in a two-piece design for larger processor sizes and provides better flatness, reliability and connectivity while improving warpage. In addition, TE offers flexible tools for rapid prototyping of production prototypes, helping engineers get socket samples during the initial stages of the design process.
"With the new CPUs in the latest server platforms and HPC solutions, designers need CPU sockets that enable high performance and reliable connectivity," said Jaren May, product management manager for TE Data and End Devices. "The new LGA 3647 socket will Help designers complete new system designs and demonstrate their leading performance through robust design to meet the technical needs of next-generation processors."
For more information on TE's LGA 3647 socket, please visit:
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Guangdong Ojun Technology Co., Ltd. , https://www.ojunconnector.com