Since white light-emitting diodes (LEDs) have reached a level of 15-20 lumens per watt in 2000, countries have begun to actively invest in R & D and manufacturing of LEDs, and related marketing, technology evaluation institutions, and academia are actively promising this. To decode sex products, explore their mysteries and commercial value, and raise negative questions or explosive forward-looking predictions one after another.
However, due to factors such as energy shortage, global warming, and rising prices of energy materials, etc., are deeply valued by governments of various countries, and the market heat of LEDs is accelerated. The value of white LED produced by the light powder in the market, and the new thinking of LED application in the rear light of the vehicle can achieve rapid response, reduce replacement and increase the aesthetics of industrial products, and gradually open up another market application opportunity, which in turn encourages relevant supply chain manufacturers R.
Although in 2003, the LED brightness performance failed to meet the needs of the main lighting (Table 1), but it has gradually made the world pay attention to the future of LED and the threat to traditional light sources.
Table 1 OIDA's LED performance estimates for 2002-2020
According to the prediction of the American Optoelectronics Industry Association (OIDA), even if the LED has reached $ 10 per thousand lumens this year, it is still far from reaching $ 10 per thousand lumens for the entire group of bulbs or lamps, especially adding color rendering ( CRI) demand, light source efficiency and market price will be a major issue that supply chain manufacturers must jointly solve.
Although the application of LED is extremely extensive, and each application industry will face different levels of technical problems, we only propose design solutions for lighting applications to accelerate the quality and speed of integrated development of the LED lighting industry.
LED lamp supplier leading industry specifications
Things to pay attention to to successfully develop an LED lighting product are quite tedious and complicated. A trading company of three to five people may bring in operating profits, but after the world norms are formulated, the entry barrier is also raised and the screening The application of small factories with poor physique has even led to the concentration of LED lighting towards the leading manufacturers of professional technology and professional OEM manufacturing because of the universalized cost structure.
Today's major customers are more devoted to exploring upstream materials, technical depth and integration capabilities as the evaluation criteria. The technical depth and breadth of development at each stage will be the work that must be completed to successfully enter LED lighting from 2009 to 2012, because the standards are not yet complete, and market demand determines the solutions that suppliers can provide.
More than half the efficiency depends on the efficiency of the chip / package process
Regarding chip development, from flip-chip (Flip Chip) chips such as Philips, vertical (VerTIcle) chips such as Cree and SemiLEDs, the positive and negative electrodes are stepped planar bonding wires, and completely planar bonding wires such as Nichia and Toyota Synthesis (TG), Epistar, etc .; plus the location of the roughness (Roughness) structure and the different ways of formation, all affect the light extraction efficiency, light emission angle, heat conduction, node (Tj) temperature, solid crystal material , Patented issues of solid crystal method, hard pull thrust, welding wire parameters and structural design. Whether you understand the relationship between the chip and the subsequent packaging process, determine the yield of LED lighting products more than half, the development of LED lighting applications must understand the details of differences, as a basis for design judgment, currently no LED chip is the best, only Only the most suitable LED chip can achieve the optimization of market demand.
Multiple factors affect LED package performance
As for packaging development, under the fixed single-type chip, many impact factors determine whether the performance, reliability, and life of the packaged LED components can withstand the market test, including:
? Design choice of carrier substrate
Metal bracket, FR4 COB (Chip on Board) type, low temperature co-fired alumina ceramic, high temperature alumina, alumina substrate plus metal silver or copper block (Slug), aluminum nitride substrate, aluminum substrate, copper substrate, laminating machine Differences in materials such as boards, including the interaction between the mechanical structure of the above materials and the binding force of light and environment (such as moisture temperature, etc.).
? Light-related process design
The position of the solid crystal bonding wire area, the design of the size, the solid crystal bonding wire area, the solid crystal method (silicon insulating glue, silver thermal conductive adhesive, flux, total gold welding, etc.), and the surrounding materials such as gold, silver, copper, aluminum, Palladium silver, palladium gold, high heat-resistant plastic (PPA), silicon, etc., encapsulating colloid (viscosity, refractive index, temperature and weather resistance and adhesion of adjacent materials, etc.).
? Multiple mixing of fluorescent powder, wavelength matching, concentration matching, coating method, operation time and precipitation control.
? Color temperature / voltage / brightness / color rendering
All will affect the light efficiency, life, quality, etc. However, the selection of different chips will inevitably re-evaluate all or part of the impact factors.
Design / selection of light source components should not be ignored
Figure 2 3D construction of product organization and mold assembly must fully understand the characteristics of LED light source, optoelectronic thermal, and computer simulation of light and heat to ensure reliability and performance.
As far as LED lighting is concerned, the LED light source component is determined (Figure 1), and the next face: the design of secondary optical lenses and reflectors to achieve the light type, light intensity distribution or optics required by the lighting in different applications The consideration of component materials causing light decay and cracking to the environment. In addition, the module design plus circuit, electronic control design, constant current source, dimming module, DMX system control module, part of the heat conduction design, part of the mechanism design, assembly design, etc., must meet the customer's functional requirements, while Conditions exist that do not cause accelerated damage to the LED light source element. Finally, thermal conduction (Thermal ConducTIvity) thermal rigidity and thermal management (Thermal Management), at the module end, strive to reduce the temperature of the LED node, evenly and quickly disperse the heat concentration area on all sides, and include insulation design considerations such as safety regulations .
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