In modern green lighting, LEDs have become an integral part of lighting equipment. This shows the importance of light-emitting diodes. However, the way LEDs are packaged is the decisive factor in determining the quality and efficiency of LED lighting. This also requires designers to pay attention to packaging methods and designs.
Leaded package
Patch package
The LED chip is bonded to the micro-lead frame, and after the electrode lead is soldered, the light-emitting surface is generally encapsulated with epoxy resin by injection molding.
Dual in-line package
The chip is fixed with a copper lead frame similar to the IC package, and the electrode lead is soldered and sealed with a transparent epoxy. Commonly used are various "cavity" packages and super piranha packages with different bottom cavities. The heat dissipation is better, the thermal resistance is lower, and the input power of the LED can reach 0.1W~0.5W, which is larger than the lead type device, but the cost is high.
Power package
There are many types of power LED packages. It is characterized by a large bottom cavity of the bonding chip, a specular reflection capability, a high thermal conductivity, and a low enough thermal resistance to allow the heat in the chip to be quickly introduced. Outside the device, keep the temperature difference between the chip and the ambient temperature.
The above five kinds of LED mainstream packaging forms are several mainstream packaging methods that are commonly used in the field. Understanding these packaging methods will help the designer understand the LEDs and complete the relevant designs more quickly and accurately. I hope everyone can gain something after reading this article.
In the process of intelligent lighting design, there are many packaging forms of LED chips. There are various packaging forms for different use requirements and different photoelectric characteristics. It can be summarized into the following common forms.
Soft package
Leaded package
figure 1
It is common to fix the LED chip on the 2000 series lead frame, and after soldering the electrode lead, it is encapsulated into a certain transparent shape with epoxy resin to become a single LED device. Such pins or packages can be divided into φ3 and φ5 diameter packages according to their external dimensions. The characteristics of this kind of package is to control the distance from the chip to the light-emitting surface, and various light-emitting angles can be obtained: 15°, 30°, 45°, 60°, 90°, 120°, etc., and the side illumination requirements can also be obtained. It is easier to automate production.Patch package
The LED chip is bonded to the micro-lead frame, and after the electrode lead is soldered, the light-emitting surface is generally encapsulated with epoxy resin by injection molding.
Dual in-line package
The chip is fixed with a copper lead frame similar to the IC package, and the electrode lead is soldered and sealed with a transparent epoxy. Commonly used are various "cavity" packages and super piranha packages with different bottom cavities. The heat dissipation is better, the thermal resistance is lower, and the input power of the LED can reach 0.1W~0.5W, which is larger than the lead type device, but the cost is high.
Power package
There are many types of power LED packages. It is characterized by a large bottom cavity of the bonding chip, a specular reflection capability, a high thermal conductivity, and a low enough thermal resistance to allow the heat in the chip to be quickly introduced. Outside the device, keep the temperature difference between the chip and the ambient temperature.
The above five kinds of LED mainstream packaging forms are several mainstream packaging methods that are commonly used in the field. Understanding these packaging methods will help the designer understand the LEDs and complete the relevant designs more quickly and accurately. I hope everyone can gain something after reading this article.
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