Ceramic substrate materials are widely used in power electronics, electronic packaging, hybrid microelectronics and multi-chip modules due to their excellent thermal conductivity and air tightness. This paper briefly introduces the current status and future development of ceramic substrates.
1. Comparison of plastic and ceramic materials
Plastics, especially epoxy resins, still dominate the entire electronics market due to their relatively good economics, but many special fields such as high temperature, coefficient of linear expansion, mismatch, air tightness, stability, and mechanical properties are obvious. Not suitable, even if a large amount of organic bromide is added to the epoxy resin, it does not help.
Compared with plastic materials, ceramic materials play an important role in the electronics industry. They have high electrical resistance, high frequency characteristics, high thermal conductivity, good chemical stability, high thermal stability and high melting point. These properties are highly desirable in the design and manufacture of electronic circuits, so ceramics are widely used for substrate materials of different thick films, films or circuits, and can also be used as insulators for conducting thermal paths in thermally demanding circuits. To manufacture a variety of electronic components.
2. Comparison of various ceramic materials
2.1 Al2O3
So far, alumina substrates are the most commonly used substrate materials in the electronics industry because of their high mechanical and thermal properties, high strength and chemical stability relative to most other oxide ceramics, and abundant raw material sources. A variety of technical manufacturing and different shapes.
2.2 BeO
It has a higher thermal conductivity than metal aluminum and is used in applications requiring high thermal conductivity, but it rapidly decreases after the temperature exceeds 300 °C.
The most important thing is that its toxicity limits its development.
2.3 AlN
AlN has two very important properties worth noting: one is a high thermal conductivity and the other is a coefficient of expansion that matches Si. The disadvantage is that even a very thin oxide layer on the surface has an effect on the thermal conductivity. Only a strict control of the material and process can produce a uniform ARN substrate. At present, the large-scale production technology of AlN is still immature in China. Compared with Al2O3, the price of AlN is relatively high, which is also a bottleneck restricting its development. Based on the above reasons, it can be known that alumina ceramics are widely used in the fields of microelectronics, power electronics, hybrid microelectronics, and power modules due to their superior comprehensive performance.
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