AMD RX Vgea 64 disassembly evaluation: Will the height and leveling package affect the heat dissipation?

The AMD RX Vega 64 graphics card has been officially launched, making it the number one rival of the GTX 1080.

RX Vega is the first consumer-grade product to use HBM2 generation memory, the particles come from Samsung, of which Vega 64 uses two stacks, a total of 8GB.

HBM memory is different from GDDR5, which can be packaged with the GPU. The two are physically interconnected by means of a silicon interposer, while the latter are "scattered by the stars".

At this point, the Dutch media Hardware.Info has a fun discovery, on one of them Vega 64, the GPU core is significantly higher than the HBM2 memory chip, that is, not at a level.

On the other hand, the difference between the GPU and the memory is evened out.

HW also analyzed that it is because of this difference that the latter must have the padding design of HBM2, so it will partially affect the heat dissipation.

The website was unyielding, and AMD did not respond. They asked the channel partners. The latter said that this is because the HBM2 memory and GPU package were handed over to the two companies, which may have caused the above differences. However, the heightening and leveling itself is also a common practice in the packaging industry. There is nothing wrong with it.

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